Introduction to Multi line Cutting Machine

      Multi wire cutting is a cutting method that uses high-speed reciprocating motion of metal wires to bring abrasives into the semiconductor processing area for grinding, cutting hard and brittle materials such as semiconductors into hundreds of thin sheets at once. Numerical control multi wire cutting machines have gradually replaced traditional inner circle cutting and become the main method for silicon wafer cutting and processing.

      A high-precision CNC multi line high-speed cutting machine developed based on key technologies for high-precision, high-speed, and low-power cutting control can comprehensively achieve high-precision, high-speed, and low loss cutting of semiconductor materials and various hard and brittle materials; The tension control technology of the cutting line, the synchronization technology of the winding motor and the main motor.

      Silicon wafers are the main production materials in the semiconductor and photovoltaic fields. The multi wire cutting technology for silicon wafers is currently the most advanced processing technology for silicon wafers. It is different from traditional cutting methods such as knife saw blades and grinding wheel blades, as well as laser cutting and inner circle cutting. Its principle is to use a high-speed moving steel wire to drive the cutting blade attached to the steel wire to rub against the silicon rod, thereby achieving the cutting effect. Throughout the process, the steel wire is guided by more than ten wire wheels to form a wire mesh on the main roller, while the workpiece to be processed is fed through the descent of the worktable. Compared with other technologies, silicon wafer multi wire cutting technology has the advantages of high efficiency, high production capacity, and high precision. It is currently widely used silicon wafer cutting technology.

      Multi Wire Slice (MWS) technology is an innovative process for cutting brittle and hard materials such as silicon ingots. In this process, the cutting line is wrapped around a guide axis, which can perform hundreds of cuts simultaneously and obtain hundreds of slices.

      The MWS process can be further divided into two process branches, one is the traditional and widely used cutting and polishing process, and the other is the cutting and grinding process. The cutting and polishing process uses uncoated cutting lines, which are coated with polishing solution during the cutting process. The cutting and grinding process uses cutting lines coated with diamond sand for cutting, which can achieve ideal segmentation results and greatly improve production efficiency.