Good News | Our companys invention patent for A Roller Support Structure and Its Multi-Wire Cutting Machine has been officially approved, achieving a leapfrog upgrade in equipment performance.

Recently, Yutian Changtong Electronics Co., Ltd. has added another national-level core technological achievement! The invention patent titled "A Roller Bracket and Its Multi-Wire Slicing Machine", independently developed and filed by our company, has officially been granted authorization by the National Intellectual Property Administration on July 14, 2026 after rigorous examination. Initiated for R&D and patent filing in 2023, this patent has undergone three years of technical refinement and process iteration. It marks another critical technological breakthrough for our company in the core structure, precision stability and equipment versatility of multi-wire slicing, further consolidating our technological moat as a specialized, sophisticated, unique and innovative enterprise.

The authorized invention patent for the roller bracket structure is an innovative structural technology developed to address prevalent industry pain points of small-scale multi-wire slicers, including low wire replacement efficiency, limited processing span, insufficient precision stability and poor ultra-fine wire slicing capacity. It comprehensively optimizes the drawbacks of traditional small slicing equipment, greatly boosting the practicality, versatility and high-end processing performance of the machines, and delivers an all-new solution for small-batch, multi-specification and high-precision slicing scenarios.

 I. Dramatically Improved Specification Switching Efficiency, Perfectly Suited for Small-Batch and Sample Orders

For conventional equivalent equipment, replacing upper and lower rollers, rewinding wires and adjusting specifications normally takes 40 minutes to one hour. The cumbersome procedures and long waiting time severely hinder sample preparation efficiency and small-batch delivery speed.

Benefiting from the brand-new patented structural design, our equipment completes roller replacement, full wire rewinding and specification switching within only 15 minutes, lifting roller replacement efficiency by over three times.

This technological innovation is highly compatible with sample trial slicing, multi-specification small-batch orders and frequent dimension switching processes. It drastically cuts equipment standby time and enhances workshop production flexibility, enabling customers to achieve fast production of small orders, alternating processing of multiple orders and rapid sample preparation as a regular practice. It effectively reduces customers' production costs and improves delivery efficiency.

II. Innovative Bracket Structure for Strict Coaxiality Control, Dual Guarantees for Equipment Precision and Stability

One of the core highlights of this patent lies in its capability to deliver ultra-fast roller replacement while maintaining exceptional coaxial precision of the equipment.

Most quick-disassembling structures available on the market prioritize rapid disassembly at the cost of operational precision, as convenient roller replacement tends to compromise equipment accuracy during operation. Our self-developed triangular bracket locking structure adopts exclusive mechanical constraint design. It tightly locks the operational coaxiality of rollers while facilitating easy assembly and disassembly, eliminating vibration, offset and cumulative dimensional deviation. The long-term operational stability of the equipment is significantly enhanced, ensuring consistent slicing thickness and flatness from the structural root, and striking an optimal balance between processing efficiency and machining precision.

III. Breaking Processing Limitations of Small-Sized Equipment to Cover an Ultra-Wide Slicing Span Range

Conventional small slicers equipped with rollers shorter than 300mm face universal processing constraints: their maximum slicing thickness is merely 8mm, failing to meet the processing demands of thick workpieces. Such equipment suffers narrow applicable scenarios and poor versatility.

Leveraging the innovative span structure of the patented roller bracket, our small-scale multi-wire slicing machine achieves a leap-forward performance breakthrough:

The machine retains its advantages of compact size, lightweight design and high cost-performance ratio, while its maximum slicing thickness is raised to 40mm.

Thus, our small-sized equipment achieves full dimensional coverage capacity:

- Ultra-thin slice processing: Precision slicing of ultra-thin wafers at 0.3mm and 0.5mm

- Conventional medium-thick slice processing

- Thick workpiece processing: Slicing of workpieces up to 40mm in thickness

A single machine can satisfy the slicing dimension requirements of most hard and brittle materials, completely resolving the functional monotony flaw of traditional small equipment which can only process thin wafers. It truly realizes a compact machine body with powerful functions and universal adaptability across all processing scenarios.

 IV. Support for 5-Micron Ultra-Fine Wire Slicing, Fully Upgraded High-End Precision Machining Capacity

Relying on the ultra-high coaxiality and ultra-low vibration performance brought by the patented structure, our small multi-wire slicing machine can stably adapt to the slicing process using 5-micron diamond ultra-fine wires.

Ultra-fine wire slicing boasts remarkable advantages:

1. Extremely low kerf loss, substantially raising customers' wafer yield and material utilization rate

2. Effective suppression of edge chipping, cracks and cutting marks

3. Noticeable improvement in the surface roughness of workpieces

It enables high-quality and high-yield processing of various high-end precision ceramics, magnetic materials and semiconductor hard brittle materials. Small-sized equipment can now undertake high-end precision slicing orders, greatly lifting the added value and market competitiveness of customers' products.

Continuous Deep Cultivation in Scientific and Technological Innovation, Ingenious R&D Empowers Industrial Upgrading

The successful authorization of this invention patent represents a vital achievement of Changtong Electronics’ persistent deep cultivation of core multi-wire slicing technologies, commitment to independent innovation and relentless pursuit of superior equipment quality.

Moving forward, Changtong Electronics will continue to take independent technology development, self-researched precision control and self-monitored product quality as its core pillars. We will continuously break through bottlenecks in slicing processes, iterate innovative equipment structures, and deliver more high-value invention patents and utility model technologies. With more stable, advanced and efficient slicing equipment, we will assist slicing processing enterprises worldwide in cost reduction, efficiency improvement and quality upgrading, and keep fueling the high-quality development of the entire industry.