Returning with a full load – showcasing exceptional capabilities | The 2026 Shenzhen International Optoelectronics and Semiconductor Expo has successfully concluded!

From September 9 to 11, the Shenzhen International Optoelectronics and Semiconductor Expo was grandly held at Shenzhen World Exhibition & Convention Center. As a prestigious industry event in the optoelectronics, semiconductor and hard-brittle material processing sectors, this exhibition gathered high-quality upstream and downstream enterprises worldwide to showcase cutting-edge technologies and high-end intelligent equipment.

Yutian Changtong Electronics Co., Ltd. made its appearance at the show with three core multi-wire saw models. Leveraging stable equipment performance, differentiated technological advantages and mature mass-production process solutions, the company received recognition from many new and existing customers. The exhibition concluded successfully with fruitful outcomes.

Three Main Models on Display, Covering Full-Scenario Cutting Requirements

In line with market trends, our company presented three independently developed multi-wire saws with multiple technical patents: the 260 single-station model, the 690 dual-station model and the 4646 extra-large specification model. They fully cover application scenarios including small-batch sampling, mass production and machining of extra-large workpieces.

260 Single-Station Multi-Wire Saw

Designed for small-batch, high-precision trial cutting, it features outstanding mold change efficiency. With optimized overall structure and easy roller disassembly & assembly, roller replacement and complete wire winding can be finished within 15 minutes, greatly reducing machine setup waiting time. Well suited for R&D sampling and multi-spec small-batch orders, it delivers better flexibility than conventional equipment in the industry.

690 Dual-Station Multi-Wire Saw

Built for mass slicing and squaring production with strong overall capacity and high stability. Supporting both slicing and squaring processes, it adopts customized rollers and optimized wire winding structure, capable of processing workpieces up to 65 mm in thickness. Ideal for mass production of medium & large-sized optical glass, crystals, quartz and more, it serves as the main production equipment for optical communication and optical component manufacturing.

4646 Extra-Large Specification Multi-Wire Saw

Custom-engineered for extra-large workpieces, this machine achieves a maximum cutting height of 460 mm. Through precise overall structural design, the total machine height is controlled at 2.7 meters. While maintaining the large machining travel, it improves operational safety and convenience, easing the pain points of bulky structure and high operational risks common among large-sized equipment in the industry.

High-End Customers Gather, In-Depth Communications with Global Leading Enterprises

Our booth maintained steady high traffic throughout the exhibition, receiving thousands of professional visitors from the industry. We successfully engaged with multiple leading enterprises and their overseas branches.

We hosted representatives from Schott headquarters and the overseas branch of Fuzhou GT Advanced at our booth.

• As our long-term partner, Fuzhou GT Advanced sent representatives from its overseas branch to inspect new machine processes and upgraded performance.

• Schott, a leading optical enterprise, reached high-intent cooperation with us, laying a solid foundation for future supporting supply and joint process development.

Recognition from many benchmark enterprises in optics and semiconductor sectors further validates Changtong Electronics’ technical strength and market reputation in high-precision hard-brittle material cutting.

Rising Demand in Optical Communication & Semiconductor Sectors, Widely Recognized Process Solutions

In 2026, market demand in the semiconductor and optical communication industries keeps growing. Requirements for precision cutting of high-end optical components, wafers, ceramic substrates and quartz materials have increased substantially.

We have accumulated abundant mature application cases in hard-brittle material processing for optical communication and semiconductor industries. Stable processing capabilities include:

• Batch precision cutting of various metallic materials

• Mass slicing of high-precision hard-brittle materials such as optical glass, quartz, wafers and ceramic substrates

Equipment sales for optical communication and semiconductor sectors alone account for one-third of our total sales volume, fully demonstrating the advantages of our machines in stability, practicality and cost performance for high-precision cutting applications.

Deep Technology R&D, Continuously Empowering High-Quality Industrial Development

The Shenzhen Optoelectronics Expo marks not only a product showcase, but also a platform for industry resource integration and technical exchanges. Moving forward, Changtong Electronics will keep investing in core multi-wire cutting technologies, continuously optimizing equipment precision, stability, mold-changing efficiency and mass production capacity. We provide more reliable, cost-effective and mature one-stop cutting solutions for customers in optics, semiconductors, optical communications and new materials industries.

We sincerely invite new and existing customers to make inquiries, visit our factory and arrange sample testing. Let’s seize new opportunities for win-win cooperation!